• High Performance Silicone Room Temperature Curing Adhesive
  • thermal conductivity 0.7-1.0W/m*K
  • Two-component addition molding silicone rubber
  • No corrosion on copper
  • Low viscosity for ease of operation and application
  • Low shrinkage, temperature-controlled fixed-line speed
  • flame retardant rating: UL 94-V0
  • Power potting protection
  • LED power potting
  • Electrical circuit collection potting
  • A/B glue is evenly mixed according to 1:1, and after vacuum evacuation, the potting operation is performed.
  • Room temperature operation time: 40 minutes for NT221A and 30 minutes for NT221B.
  • Room curing time: 24hrs.
  • This product can be cured at room temperature for 24 hours. When the room temperature is lower than 20 °C, the curing speed will decrease accordingly. If fast curing is required, it can be achieved by heating.
  • NT221A

    NT221B