- High Performance Silicone Room Temperature Curing Adhesive
- thermal conductivity 0.7-1.0W/m*K
- Two-component addition molding silicone rubber
- No corrosion on copper
- Low viscosity for ease of operation and application
- Low shrinkage, temperature-controlled fixed-line speed
- flame retardant rating: UL 94-V0
- Power potting protection
- LED power potting
- Electrical circuit collection potting
- A/B glue is evenly mixed according to 1:1, and after vacuum evacuation, the potting operation is performed.
- Room temperature operation time: 40 minutes for NT221A and 30 minutes for NT221B.
- Room curing time: 24hrs.
- This product can be cured at room temperature for 24 hours. When the room temperature is lower than 20 °C, the curing speed will decrease accordingly. If fast curing is required, it can be achieved by heating.