• Professional laser cracking technology, using the instantaneous heat and cold shrinkage stress to let the material crack naturally
  • Applies to all brittle materials and can completely cut targets at once
  • Reducing residual stress and micro-defects on the cutting line
  • Highly precise processing, highly clean processing, fast cutting speed
  • Applicable to a variety of materials High-precision cutting

Laser Controlled Thermal Cracking

  • Direct cut-through without damaging blue tape, breaking process is not necessary
  • Crack-free, smooth cleaving surface
  • 40~900μm thick, broad cutting range

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Cutting end face roughness:Ra=4.5nm,Rq=5.8nm,Rz=37.7nm