- 專業雷射裂解法技術,利用瞬間的熱漲冷縮應力讓材料自然的裂開
- 適用於所有的脆硬材料,並可一次徹底切開目標
- 減少切割線上殘留應力和微缺陷
- 高度精確處理,高度清潔處理,切割速度快
- 適用於各種材質 高精准度切割

雷射控制熱裂解 Laser Controlled Thermal Cracking

- Direct cut-through without damaging blue tape, breaking process is not necessary
- Crack-free, smooth cleaving surface
- 40~900μm thick, broad cutting range
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切割端面粗糙度:Ra=4.5nm,Rq=5.8nm,Rz=37.7nm








